Lam Research and JSR Corporation/Inpria Corporation Enter Cross-Licensing, Collaboration Agreement to Advance Semiconductor Manufacturing
Air Monitoring

Lam Research and JSR Corporation/Inpria Corporation Enter Cross-Licensing, Collaboration Agreement to Advance Semiconductor Manufacturing

Companies to Focus on Patterning for Leading-Edge Chips, Including Dry Resist EUV Lithography and Next-Generation Materials 

FREMONT, Calif. and TOKYO, Sept. 15, 2025 /PRNewswire/ — Lam Research Corp. (Nasdaq: LRCX), a global leader in semiconductor fabrication equipment and services, and JSR Corporation, a leading technology company focused on materials innovation solutions and the parent company of Inpria Corporation, a metal oxide photoresist solution provider, today announced that Lam and JSR/Inpria have entered into a non-exclusive cross-licensing and collaboration agreement to advance leading-edge semiconductor manufacturing. The partnership is intended to accelerate the industry’s transition to next-generation patterning, including dry resist technology for extreme ultraviolet (EUV) lithography, and advance the development of next-generation materials for atomic layer etching and deposition processes.

The agreement capitalizes on JSR group’s innovative semiconductor materials, including metal oxide solutions, and Lam’s deep capabilities in deposition, etch, and EUV patterning, including Aether®, Lam’s groundbreaking dry resist equipment and process technology that reduces the cost and complexity of creating the intricate patterns required for chips for artificial intelligence (AI) and high-performance computing (HPC).